Apple just released its latest OS 10 for its upcoming iPhone 7, there have been a several leaks around as the time is near, Apple is unveiling its new iPhone as it will be named as iPhone 7 by just a recent leaked box packaging of it.
The most interesting rumor was it will ditch the 3.5mm headphone jack, meaning users have will have to conncet to Lightning charger output or Bluetooth in order to get audio output. But according to the latest leak by Rock Fix a repair shop based in China’s Guangzhou, it will not ditch headphone jack as seen in photos of alleged iPhone 7 components. And more recently, the shop shared photos of what it claims to be the next iPhone’s dual-SIM trays, which will be a first for Apple if true.
Other parts of the Rock fix shows :
- panels in the usual two sizes,
- some SanDisk memory chips of up to a whopping 256GB,
- plus a dual-lens camera for the larger model.
The shop owner also told us that there will be some changes to the antenna design, though he clarified that this won’t get rid of those antenna bands on the back of the phone; maybe it’s more to do with the rumored switch to Intel’s modem for the GSM models.